Connection of a semiconductor to elements of a support, especially of a portable card
AssigneeU.S. Philips Corporation
InventorsPaul Parmentier, Philippe Jourdan
Life of this patent
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Abstract
There is started from an entirely insulating support (2), of which a part (7, 8) is very thin; a chip (5) of an integrated circuit is arranged so that its metallizations are opposite the holes (4) provided in the thin support behorehand, and the conducting tracks (9) and the contacts with the integrated circuit are obtained in one operation by means of a conducting paste applied by screen printing, which covers the holes and penetrates into them in order to establish a contact with the chip.
Claims1
An identity card provided with flat conducting elements situated on an external surface of a wall of said card, which conducting elements are connected to metallized termination areas of a semiconductor wafer so that an electrical connection can be established with a member separate from said wall characterized in that:
- said conducting elements are constituted by a polymerized conducting material;
- the semiconductor wafer is situated within said card and is positioned so that its metallized termination areas face said wall;
- said wall is provided with holes opposite said metallized termination areas;
- and
- parts of said flat conducting elements each penetrate into one of said holes while contacting the metallized terminal area positioned opposite said hole and covering at least in part said hole, thus providing electrical contact between said metalized termination area opposite said hole and said flat conducting element at least partially covering said hole.
Dependencies are inferred from the claim text.