Process for producing polyimide/metallic foil composite film

Abstract

A polyimide/metallic foil composite film having a curvature radius of at least 25 cm and which is substantially free from curling is described, comprising coating a solution of a polyimide precursor in an organic polar solvent on a 1 to 500 .mu.m thick metallic foil, the polyimide precursor being prepared by reacting a diamine component comprising p-phenylenediamine and an aromatic tetracarboxylic acid component comprising 3,3',4,4'-biphenyltetracarboxylic dianhydride or its derivative; heat-drying the above-prepared coating in the state that the metallic foil is fixed; and then heating it at a high temperature to form a 5 to 200 .mu.m thick polymide film. This composite film does not substantially curl in either the lengthwise and widthwise directions and is very suitable for use in the production of an electrical circuit board.

Dependencies are inferred from the claim text.