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US 4,731,130 AGranted
Soldering composition
AssigneeGTE Government Systems Corporation
InventorDaniel J. O'Leary
Life of this patent
Estimating the term…
Abstract
A solder paste contains solder plated copper spheres in addition to particulate solder and flux. The paste can be used to solder leadless component carriers or the like to printed circuit boards., After melting the solder, the copper spheres are embedded in the resulting solder matrix, offsetting the carrier from the printed circuit board.
Claims2
A soldering composition suitable for soldering leadless component carriers and to provide an offset to printed circuit boards, comprising:
- (a) particulate solder;
- (b) flux;
- and
- (c) solder plated copper powder.
1 more element
Dependencies are inferred from the claim text.