Double sided mounting module for surface mount integrated circuits
AssigneeGould Inc.
InventorCarl R. Cook
Life of this patent
Estimating the term…
Loading patent…
AssigneeGould Inc.
InventorCarl R. Cook
Estimating the term…
A multiple layer connection system for compactly connecting a plurality of surface mount integrated circuit packages to a printed circuit board is disclosed. A plurality of staggered metal legs is respectively inserted into a plurality of slots formed along an edge of an intermediate plastic sheet. A first outside sheet and a second outside sheet sandwich the intermediate sheet between themselves. The first outside sheet has a plurality of foil conductors formed on an inside layer thereof to connect with a first portion of the staggered legs. A plurality of feed through holes are in electrical connection with the first conductive traces and with a plurality of first outside foil traces which are connectable by soldering to the legs of a surface mount integrated circuit package. A second plurality of inside foil traces is formed on an inside layer of the second plastic sheet and contacts a second group of the legs. A second plurality of feed through holes connects the second plurality of inside foil to a second plurality of outside foil traces formed on an outside layer of the second sheet. A second integrated circuit surface mount device is connectable by soldering to the second plurality of outside conductive traces.
A mounting module for electrically connecting a surface mount integrated circuit to a printed circuit board, comprising:
Dependencies are inferred from the claim text.