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US 4,730,235 AGranted
Cascadable carrier for high power semiconductors or other electronic components
AssigneeItek Corporation
InventorCharles M. Newton
Life of this patent
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AssigneeItek Corporation
InventorCharles M. Newton
Estimating the term…
A carrier for electronic components which generate heat during their operation, such as high power semiconductors, is disclosed. The carrier includes complementary ends which are designed to permit the second end of a first carrier to abut and overlap the first end of a second carrier to conserve space when more than one carrier is mounted on a substrate containing an electronic circuit. Preferably each end of each carrier has an aperture bored therethrough to allow the carrier to be mounted to the substrate with fasteners such as screws. The apertures are located so that the aperture in the second end of a first carrier aligns with the aperture in the first end of a second carrier to permit a first and a second carrier to be fastened to the substrate with a common fastener passing through the aligned apertures. Similarly, the aperture in the second end of a second carrier is positioned to align with an aperture in the first end of another carrier. Thus, multiple carriers may be fastened to a substrate or other mounting surface using fasteners shared by two carriers.
In an electronic circuit having two or more electronic components which generate heat as a byproduct of their operation, the electronic circuit being mounted to a retaining means, at least two carriers for mounting said electronic components to said retaining means, each of said carriers permitting heat generated during the operation of each of said electronic components to be conducted away from said electronic components, each of said carriers having a body portion to which a one of said electronic components may be mounted and a first stepped end at a first end of said body portion and a second stepped end at a second end of said body portion, said first stepped end and said second stepped end being constructed so that the second stepped end of a one of said carriers overlies and contacts the first stepped end of another one of said carriers when two of said carriers are mounted in contact with each other on said retaining means, said carriers being retained to said retaining means by at least a fastener common to both of said carriers.
In an electronic circuit contained in a package, the package including a retaining means, said electronic circuit having two or more electronic components which generate heat as a byproduct of the operation of said electronic components, at least two carriers for mounting said electronic components to said retaining means, each of said carriers having a central body portion with a first end portion and a second end portion, said first end portion being located at a first end of said body portion and said second end portion being located at a second end of said body portion, said first end portion and said second end portion being shaped so that the second end portion of one of said carriers abuts and at least partially overlies the first end portion of another of said carriers when one of said carriers is mounted against another of said carriers and said carriers are mounted to said retaining means, with two of said carriers being retained to said retaining means by at least a fastener common to both of said carriers.
Dependencies are inferred from the claim text.