A multi-chip, high density, light-weight module having fully demountable covers, producing low capacitance and low power dissipation, said module operable to function at high clock speeds, comprising:
- a first and a second multi-layer circuit board, both of said boards having a first and a second planar lateral surface, and a first and second end, said first and said second printed circuit boards both, further comprising;
- a multiplicity of fully enclosed individually hermetically sealed, microelectronic chip packages mounted upon said first lateral surfaces of said first and said second multi-layer circuit boards, said microelectronic chip packages further comprising, a single layer of insulating material having a region sufficient to receive and retain a microelectronic chip, a multiplicity of electrically conductive chip lead lines in a fanout configuration, said chip lead lines configured with a predetermined spacing, further said chip lead lines wirebonded to circuit board bonding pads upon said first and said second multi-layer circuit boards, by wirebonds,
- a multiplicity of electrically conductive connecting means layered within and upon said first and said second multi-layer printed circuit boards, said electrically conductive connecting means operable to interconnect via said first and said second multi-layer circuit board bonding pads and said wirebonds, said individual microelectronic chip packages thereby forming electrical circuits upon said first lateral surfaces of said first and said second multi-layer printed circuit boards,
- a multiplicity of input and output electrically conductive circuit board lead lines positioned at said first ends of said first and said second multi-layer printed circuit boards, said circuit board lead lines operable to input electrical signals into said circuits layered within and upon said first lateral surfaces of said first and said second multi-layer printed circuit boards, and said circuit board lead lines further operable to output electrical signals from said circuits within and upon said first lateral surfaces of said first and said second multi-layer printed circuit boards,
- a heat sink means layered upon said second lateral surfaces of said first and said second multi-layer printed circuit boards, said heat sink means comprising a heat conducting material operable to transfer heat generated by said microelectronic chips during said module operation, said heat sink means further physically extending beyond the full surface area of said first and said second multi-layer printed circuit boards, and said heat sink means extending beyond two opposite sides of said first and said second multi-layer circuit boards connectable to said heat sink means,
- a first and a second demountable cover means of a light-weight material, said first and said second demountable cover means operable to be placed over said first lateral surfaces of said first and said second multi-layer printed circuit boards while said first and said second multi-layer printed circuit boards are mounted against each other, the heat sink means of said first multi-layer printed circuit board contacting the heat sink means of said second multi-layer printed circuit board means, said first and said second demountable cover means operable to be fully removed to facilitate said module repair.
- a first end connector means comprising a protective end cap lined with an electrically conductive material, said first end connector means operable to interconnect said first and said second demountable cover means encovering said first and said second printed circuit boards, said first end connector means further operable to electrically interconnect said second ends of said first and said second multi-layer printed circuit boards said multiplicity of electrically conductive chip lead lines upon said first lateral surfaces of said first and said second multi-layer printed circuit boards, and
- a second end connector means said second end connector means comprising a protective end cap lined with an electrically conductive material and further comprising a multiplicity of input/output pins, said second end connector means operable to be so positioned upon the contacting ends of said first ends of said first and said second multi-layer printed circuit boards to be operable to electrically interconnect both said first and said second multi-layer printed circuit boards by said first ends by said multiplicity of input/output pins of said second end connector means operable to input and output power supply power and electrical signals to said first and said second multi-layer printed circuit boards during said module operation.