Cooling system for electronic circuit device
AssigneeFujitsu Limited
InventorsHaruhiko Yamamoto, Masaaki Sakai, Yoshiaki Udagawa, Kouji Katsuyama, Mitsuhiko Nakata
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Abstract
A cooling module for an electronic circuit component on a printed circuit board includes a passage in which a coolant flows, a first heat transfer plate exposed to the flow of the coolant, a second heat transfer plate secured to the circuit component, a compliant member between the first and second heat transfer plates for establishing a compliant contact therebetween, and a bellows connected to the first heat transfer plate to elastically press the first heat transfer plate against the circuit component through the compliant member and the second heat transfer plate.
Claims32
A cooling system used with a printed circuit board having at least one solid state electronic circuit component, said cooling system comprising:
- a cooling header having a passage through which a supply of coolant flows;
- a first heat transfer means operatively connected to said cooling header such that at least part of said first heat transfer means is exposed to the flow of the coolant, and such that heat may be transferred from said first heat transfer means to the coolant;
- an elastic, compliance means, disposed between said first heat transfer means and the electronic circuit component, and establishing an elastic, compliant contact between said first heat transfer means and the electronic circuit component;
- and
- an elastic means, connected to said first heat transfer means and said cooling header, and biasing said first heat transfer means against the circuit component through said compliance means.
A cooling system for use with a printed circuit board having a plurality of solid state electronic circuit components, said cooling system comprising:
- a cooling header having a passage through which a supply of coolant flows, said cooler header having a plurality of cooling modules receiving said coolant for each of said plurality of solid state electronic circuit components, each cooling module including,
- (a) a first heat transfer means operatively connected to said cooling module such that at least part of said first heat transfer means is exposed to the flow of the coolant, and such that heat may be transferred from said first heat transfer means to the coolant,
- (b) an elastic, compliant means, disposed between said first heat transfer means and a corresponding electronic circuit component, and establishing an elastic, compliant contact between said first heat transfer means and the corresponding electronic circuit component, and
- (c) an elastic means, connected to said first heat transfer means and said cooling header, and biasing said first heat transfer means against the corresponding circuit component through said compliance means.
Dependencies are inferred from the claim text.