Integrated circuit package with low-thermal expansion lead pieces
AssigneeHitachi, Ltd.
InventorsMasatoshi Tsuchiya, Satoru Ogihara, Hiromi Kagohara, Kanji Otsuka, Tomoji Oishi
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Abstract
An integrated circuit package in which semiconductor elements mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect them, are accommodated in a cell that is air-tightly defined by the substrate, a cap and a sealing glass. The lead pieces are composed of an alloy having a coefficient of thermal expansion nearly equal to, or smaller than, the coefficient of thermal expansion of the substrate. The alloy is an iron alloy which contains nickel and cobalt, and having a martensite transformation temperture of lower than -55.degree. C.
Claims18
In an integrated circuit package in which at least one semiconductor element mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect said at least one semiconductor element and said ends of said lead pieces are accommodated in a cell that is air-tightly defined by said substrate, a cap and a sealing glass, the improvement wherein said insulating substrate is composed of a ceramic material having a coefficient of thermal expansion of from 35 to 40.times.10.sup.-7 /.degree.C. and a high thermal conductivity, said cap is composed of a ceramic material having a coefficient of thermal expansion of from 20 to 50.times.10.sup.-7 /.degree.C., said sealing glass has a coefficient of thermal expansion of from 30 to 55.times.10.sup.-7 /.degree.C., and said lead pieces are composed of an alloy having a coefficient of thermal expansion of smaller than 40.times.10.sup.-7 /.degree.C.
In an integrated circuit package in which at least one semiconductor element is mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect said at least one semiconductor element and said ends of said lead pieces are accommodated in a cell that is air-tightly defined by said substrate, a cap and a sealing glass, the improvement wherein said insulating substrate is composed of a sintered product of aluminum nitride, said cap is composed of a ceramic material having a coefficient of thermal expansion of from 20 to 50.times.10.sup.-7 /.degree.C., said sealing glass has a coefficient of thermal expansion of from 30 to 55.times.10.sup.-7 /.degree.C., and said lead pieces are composed of an alloy having a coefficient of thermal expansion of smaller than 40.times.10.sup.-7 /.degree.C.
Dependencies are inferred from the claim text.