Masking tape for use in manufacturing a printed board
AssigneesDainippon Screen Mfg. Co., Ltd., Sanyo-Kokusaku Pulp Co., Ltd.
InventorsShigeru Sasada, Tetsuo Ohwada, Masaru Mishima
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Abstract
Disclosed is a masking tape suitable for use in manufacturing a printed circuit board. The masking tape comprises a water soluble paper as a tape base material, and a water soluble adhesive agent applied to one side of the paper. A method of filling through-holes employing such a water soluble masking tape in a process of manufacturing a printed circuit board is also disclosed.
Claims10
A masking tape for use in a process of filling through-holes in a printed board with a filler material, comprising:
- a water soluble paper as a tape base material;
- and
- a water soluble adhesive agent applied to one side of said paper.
A method for filling through-holes in a process of manufacturing a printed circuit board, comprising the steps of:
- preparing a substrate for use in manufacturing a desired printed circuit board for forming electrically conductive layers on both sides of said substrate and then forming through said conductive layers and substrate both through-holes for conducting electricity between the layers and positioning-holes for positioning said substrate at a desired position;
- covering said positioning-holes and peripheral edges of said substrate with a water soluble tape comprising a water soluble paper coated with a water soluble adhesive agent;
- filling said through-holes with a filling material capable of hardening in place;
- hardening said filling material;
- and
- removing any excess and undesirably located filling material applied on said substrate, and simultaneously removing said water soluble tape by applying water thereto.
Dependencies are inferred from the claim text.