Electrical printed circuit boards
AssigneeBayer Aktiengesellschaft
InventorsKirkor Sirinyan, Gerhard D. Wolf, Ulrich von Gizycki, Rudolf Merten
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Abstract
Electrical printed circuit boards are obtained in an elegant manner without the usual etching methods and without using bonding agent layers in a wet chemical manner on the basis of the principles of the semi or fully additive technique by using precious metal compounds for activation and base material of a type which has (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3 /m.sup.2, (b) a mean pore diameter of 0.05-5.0 .mu.m and (c) a mean pore depth of 0.05-4.0 .mu.m.
Claims5
An electrical printed circuit board consisting essentially of a base material and a metallic conductor pattern thereon, the circuit board being produced by base materials with an electrolytically produced metal foil, the cladding being removed chemically in a redox bath or electrolytically, the base material being activated with a compound of a precious metal with or without sensitization, metallic conductor patterns being applied to the semifinished products so obtained by using a semi or fully additive technique and annealing at a temperature of 50.degree. C. to 180.degree. C., wherein the activator being an organic compound of a precious metal of the 1st or 8th sub-group of the periodic system of elements and wherein the surface of the base material being characterized by
- (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3 /m.sup.2,
- (b) a mean pore diameter of 0.05-12.0 .mu.m and
- (c) a mean pore depth of 0.05-12.0 .mu.m.
Dependencies are inferred from the claim text.