US 4,728,534 A · Thick film conductor structure

Abstract

In one embodiment of the present invention a thick film resistor structure comprising common materials is disclosed. The structure includes a supporting carrier as a base for the thick film resistor arrangement, which comprises a resistive material printed on the carrier, first and second noble metal terminating layers connected to either side of the resistive material, first and second barrier layers respectively connected to the first and second noble metal terminating layers, and first and second conducting layers respectively connected to said first and second barrier layers. The barrier layers are preferably composed of nickel or tungsten, whereas the noble metal terminating layers are preferably composed of silver. The resistive material, being formed between the terminating layers, is electrically connected to said copper conducting layers to form a precise thick film resistor structure whose resistance is measurable between said conducting layers.

Claims15

Dependent claims

A method for coupling a resistive material to a conducting layer on a supporting carrier, comprising the steps of:

forming a terminating layer on the carrier;
positioning the conducting layer on the carrier such that it is separated from the terminating layer by a gap;
forming a barrier layer in the gap such that it couples the conducting layer to the terminating layer;
and, thereafter,
coupling the resistive material to the terminating layer, such that the conducting layer is coupled to the resistive material.

2 more elements

Dependencies are inferred from the claim text.

Thick film conductor structure

Life of this patent

Thick film conductor structure

Life of this patent

Abstract

Claims15