Transfer method of applying adhesive to substrates

A method of applying adhesive to substrates having a plurality of spaced-apart openings therein comprising the steps of:

• (a) providing a pad of adhesive sandwiches stacked on top of one another, each sandwich including a flexible carrier sheet having a pressure-sensitive adhesive layer releasably bonded to one surface thereof in a predetermined discontinuous pattern including openings corresponding in size and shape to the spaced-apart openings in said substrates and having an opposite surface to which the adhesive layer is bondable with substantially less tenacity than the tenacity with which the adhesive layer is bonded to the one surface, said sandwiches being stacked on top of one another with the adhesive layer on one sandwich releasably bonded to an opposite surface of a carrier sheet on an adjacent sandwich;
• stripping a sandwich from said pad;
• (b) positioning the adhesive layer on the stripped sandwich against a one of said substrates;
• (c) pressing on the carrier sheet of the stripped sandwich to bond its adhesive layer to the substrate with substantially greater tenacity than the tenacity of the bond between the adhesive layer and its carrier sheet;
• (d) pulling the carrier sheet to strip same from its adhesive layer which remains bonded to the substrate;
• and,
• (e) repeating the steps of stripping, pressing, and pulling with each sandwich in the pad.