Method for producing an optical device
AssigneeSumitomo Electric Industries, Ltd.
InventorHideaki Nishizawa
Life of this patent
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Abstract
In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central portion beforehand is prevented from rising higher at ends than in other portion after burning, irregularity on the surface of a die bonding pad is eliminated. In the optical device according to the present invention, since an electrode and a solder layer having each a light introducing hole are sequentially mounted in layers on the die-bonded side of an optical device chip which is die-bonded to the die bonding pad by said solder layer, the optical device chip is die-bonded in a stable state.
Claims19
A method for producing an optical device, comprising the steps of:
- sequentially mounting an electrode having a light passing hole on a light incident surface of an optical chip device and mounting a solder layer on said electrode;
- mounting a die bonding pad on a light passing substrate;
- and
- die-bonding said electrode on said optical chip device to said die bonding pad by using said solder layer, whereby an integral optical device is produced that is die bonded in a stable state.
A method for producing a photodiode comprising the steps of:
- seqentially mounting an electrode having a light passing hole onto a light receiving surface of a photodiode chip and mounting a solder layer onto said electrode;
- and
- die-bonding said photodiode chip to a die bonding pad by using said solder layer, whereby said photodiode chip is die bonded in a stable state.
A method for producing an optical device comprising the steps of:
- forming a die bonding pad on an upper surface of a sapphire substrate which has a tapered portion and a concavity continuous to the tapered portion by printing and heating electroconductive paste, ends of said electroconductive paste being positioned on said tapered portion and said electroconductive paste formed with a first light passing hole on said concavity to form an opening of said die bonding pad so that light passes through said sapphire substrate and said opening;
- sequentially mounting an electrode and a solder layer having a second light passing hole on a surface of a light passing side of an optical device chip;
- and
- die-bonding said optical device chip to said die bonding pad using said solder layer.
Dependencies are inferred from the claim text.