Process for improving polymer substrate properties, and modified polymers produced thereby

Abstract

A process for improving the hygroscopic, soil release and other properties of a polymer substrate is provided in which the substrate is contacted with a suitable aqueous mixture containing a water-soluble cross-linking vinyl monomer and an organic hydrophobic carrier compound at a temperature of between about 40.degree. C. to 100.degree. C. Polymerization of the monomer is thereafter initiated by a chemical or physical initiator to form a vinyl polymer evenly disposed on the substrate. The hygroscopic, soil release and other surface properties of the substrate are thereby improved. The mixture may be in the form of an emulsion wherein the hydrophobic carrier compound is emulsified by an appropriate agent. The invention also pertains to the improved substrates prepared in accordance with the present process.

Dependencies are inferred from the claim text.