Method of high speed plating
AssigneeSurtech Company Limited
InventorHironari Sawa
Life of this patent
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Abstract
Disclosed is a method of high-speed plating which comprises carrying out plating of a substrate, for example, a through-hole wiring substrate, which is under being parallelly rotated in a plane including the surface of the substrate simultaneously with being vibrated in up-and-down direction and/or in right and left direction at predetermined angle with the rotating direction.
Claims6
A method of high-speed plating which comprises carrying out plating of a substrate which is parallelly rotated in a plane including the surface of the substrate simultaneously and being vibrated in an up-and-down direction and a right and left direction at predetermined angles with respect to the rotating direction.
A method of high-speed plating which comprises carrying out plating of a substrate which is parallelly rotated in a plane including the surface of the substrate simultaneously and being vibrated in a right and left direction at a predetermined angle with respect to the rotating direction.
A method of high-speed plating which comprises carrying out plating of a substrate which is parallelly rotated in a plane including the surface of the substrate simultaneously with being vibrated in an up-and-down direction at a predetermined angle with respect to the rotating direction.
Dependencies are inferred from the claim text.