Method of making wires scribed circuit boards
AssigneeKollmorgen Technologies Corporation
InventorsBrian E. Swiggett, Ronald Morino, Raymond J. Keogh, Jonathan C. Crowell, George Czenczy, Andrew J. Schoenberg, Marju L. Friedrich
Life of this patent
Estimating the term…
Abstract
This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the conductor pattern, and can thereafter be cured to permanently bond the conductors to the board surface.
Claims34
A process for scribing at least one conductor onto a surface of a substrate in a predetermined pattern between two points spaced apart on the surface each defining a terminal point comprising:
- a. providing a conductor having an adhesive coating, which is normally non-tacky and non-blocking prior to curing, which can be activated by applying energy thereto, said adhesive coating rapidly reverting to a solid non-tacky condition within about 0 to about 200 miliseconds after activation;
- b. scribing the conductor onto the surface of the substrate from a first terminal point along a predetermined path to a second terminal point;
- c. activating at least a portion of the adhesive coating on the conductor prior to, or simultaneously with contact with the substrate surface so that a bond is formed adhering the conductor to the surface of the substrate when said activated adhesive reverts to said solid non-tacky condition;
- said reversion of said adhesive to a non-tacky state within about 0 to 200 milliseconds permitting the scribing speed along a straight path to reach a potential speed of at least 120 inches per minute while simultaneously substantially avoiding relative movement of the bonded conductors with respect to each other and the substrate surface.
A process for making an interconnection circuit board on an insulating base substrate having a plurality of points spaced apart on the surface of the substrate each defining a terminal point comprising:
- a. providing at least one conductor having an adhesive coating, the adhesive coating being non-tacky, non-blocking and flexible prior to curing and which can be activated by heat, radiant or ultrasonic energy or by a combination thereof said adhesive coating rapidly reverting to a solid non-tacky condition within about 0 to about 200 milliseconds after activation;
- b. activating a portion of the conductor having activated adhesive coating the conductor prior to or simultaneously with scribing the activated portion of the surface;
- c. scribing the activated portion of the conductor onto the surface from a first terminal point along a predetermined, precise and reproducible pattern to a second terminal point, thereby adhering the conductor to the surface by means of the adhesive coating;
- said rapid reversion of the coating permitting the scribing speed along a straight path to reach a potential speed of at least 120 inches per minutes, simultaneously allowing the conductor pattern to retain dimensional stability.
A process for modifying an interconnection circuit board by scribing at least one conductor onto a surface of the interconnection circuit board in a predetermined pattern beween two points spaced apart on the surface each defining a terminal point comprising:
- a. providing an elongated performed conductor having an adhesive coating, the adhesive coating being non-tacky, non-blocking and flexible prior to curing and which can be activated by thermal, radiant or ultrasonic energy or a combination thereof, said adhesive coating rapidly reverting to a solid non-tacky condition within about 0 to about 200 milliseconds after activation;
- b. activating a portion of the conductor having activated adhesive coating prior to or simultaneously with scribing the activated portion of the surface;
- c. scribing the activated portion of the conductor onto the surface from a first terminal point along a predetermined, precise and reproducible pattern to a second terminal point, thereby adhering the conductor to the surface by means of the adhesive coating;
- said rapid reversion of the coating permitting the scribing speed along a straight path to reach a potential speed of at least 120 inches per minute, simultaneously allowing the conductor pattern to retain dimensional stability.
A process for scribing at least one conductor onto a surface of a substrate in a predetermined pattern between two point spaced apart on the surface each defining a terminal point, said process comprising:
- a. providing a conductor having an adhesive coating, which is normally non-tacky and non-blocking prior to curing, which can be activated by applying laser energy thereto, and which reverts to a solid non-tacky condition after activation;
- b. scribing the conductor onto the surface of the substrate from a first terminal point along a predetermined path a second terminal point;
- c. activating at least a portion of the adhesive coating on the conductor prior to, or simultaneously with contact with the substrate surface by means of predetermined energy level laser pulses having a constant energy level selected to activate adhesive within the laser beam so that a bond is formed adhering the conductor to the surface of the substrate when said adhesive so activated reverts to said solid non-tacky condition, the pulse repetition rate being adjusted as a function of scribing speed to deliver a fixed number of constant energy pulses per unit length of conductor.
A process for scribing a conductor to the surface of a substrate wherein said conductor has an adhesive coating which is non-tacky, non-blocking and flexible and which can be activated by means of a laser beam which is delivered in substantially uniform discrete quanta of energy with the pulse repetition rate being a function of the length of conductor scribed, or the scribing speed, or a combination thereof, activating a portion of the adhesive coating and scribing the activated portion of the conductor to the surface.
A process for scribing a conductor to the surface of a substrate wherein said conductor has an adhesive coating which is non-tacky, non-blocking and flexible and which can be activated by means of a pulsed laser beam which is delivered in substantially uniform discrete quanta of energy with the pulse repetition rate bein a function of the length of conductor scribed, or the scribing speed, or a combination thereof, activating a portion of the adhesive coating and scribing the activated portion of the conductor to the surface, said adhesive coating containing regions of microencapsulated adhesive material capable of being released by pressure, said process comprising the further step of applying sufficient pressure to said adhesive coating to release the adhesive material at or close to the point of contact with the substrate surface such that the adhesive material forms a bond between the conductor and the substrate.
A process for scribing at least one insulated conductor onto a surface of a substrate in a predetermined pattern between two points spaced apart on the surface each defining a terminal point comprising:
- providing a conductor having an adhesive coating,
- which is normally non-tacky and non-blocking prior to activation or curing,
- which can be activated by applying energy thereto, and
- which reverts to a solid non-tacky condition after activation;
- stripping the adhesive coating and insulation from the conductor at one end;
- scribing the conductor onto the surface of the substrate from said end of the conductor at a first terminal point along a predetermined path to a second terminal point;
- activating at least a portion of the adhesive coating on the conductor prior to, or simultaneously with contact with the substrate surface so that a bond is formed adhering the conductor to the surface of the substrate when said activated adhesive reverts to said solid non-tacky condition;
- cutting the conductor in the vicinity of the second terminal point;
- and
- stripping the adhesive coating and insulating layer in the vicinity of the cut end.
A process for scribing at least one insulated conductor onto a surface of a substrate in predetermined pattern between two points spaced apart on the surface each defining a terminal point comprising:
- providing a conductor having an adhesive coating, which is normally non-tacky and non-blocking prior to activation or curing, which can be activated by applying energy thereto, and which reverts to a solid non-tacky condition after activation;
- stripping the adhesive coating and insulation from the conductor at one end;
- scribing the conductor onto the surface of the substrate from said end of the conductor at a first terminal point along a predetermined path to a second terminal point;
- activating at least a portion of the adhesive coating on the conductor prior to, or simultaneously with contact with the substrate surface so that bond is formed adhering the conductor to the surface of the
- substrate when said activated adhesive reverts to said solid non-tacky condition;
- cutting the conductor in the vicinity of the second terminal point;
- and
- stripping the adhesive coating and insulating layer in the vicinity of the cut end by a stripping means, said stripping means is a radiant energy means comprising a CO2 laser beam having a spot size sufficient for evaporating the adhesive coating and the insulating layer which is scanned repeatedly along a predetermined length of conductor.
Dependencies are inferred from the claim text.