Alignment apparatus for electronic device package

Alignment apparatus for use in connection with printed circuit boards, heat sinks and electronic device packages having pin connectors and the like, said apparatus comprising:

• (a) an electrically insulating body having connection means for releasably connecting said body to a heat sink and having a plurality of holes extending through said body for receiving, aligning and retaining the pin connectors in predetermined relationship;
• and
• (b) a securing and attachment member for attaching said alignment apparatus to the printed circuit board pivotally attached to said body and rotatable with respect to said body between said first and said second positions and having:
• (i) a pair of laterally spaced, downwardly extending mounting tabs adapted for soldering to preformed locations on a printed circuit board for mounting the alignment apparatus thereon;
• (ii) a resilient clip for securing the electronic device package in intimate thermal contact with a heat sink when said securing and attachment member is in said second position;
• and
• (iii) a latching member for releasable engagement with said body so as to maintain said securing and attachment member in said second position.

The combination comprising:

• (a) a printed circuit board;
• (b) a heat sink;
• (c) an electronic device package having one or more pin connectors extending therefrom;
• and
• (d) alignment apparatus for mounting said heat sink and said electronic device package on said printed circuit board including:
• (i) an electrically insulating body having connection means for releasably connecting said body to said heat sink and a plurality of holes extending through said body for receiving, aligning and retaining said pin connectors of said electronic device package in predetermined relationship;
• (ii) solderable securing means attached to said body and shiftable with respect to said body between a first position for loading and unloading the electronic device package from the alignment apparatus and a second position with respect to said body;
• (iii) means for securing said electronic device package in intimate thermal contact with the heat sink when said solderable securing means is in said second position;
• (iv) means for mounting the alignment apparatus, heat sink and electronic device package on the printed circuit board with the pin connectors of the electronic device package presented for soldering to preformed locations on the printed circuit board;
• and
• (v) means for releasably latching said solderable securing means in said second position.

Alignment apparatus for use in connection with printed circuit boards and electronic device packages having pin connectors and the like, said apparatus comprising:

• (a) an electrically insulating body having a plurality of holes extending through said body for receiving, aligning and retaining the pin connectors of an electronic device package in a predetermined relationship;
• (b) solderable securing and attachment means attached to said body and shiftable with respect to said body between a first position for loading and unloading the electronic device package form said body in a second position with respect to said body including:
• (i) means for securing the electronic device package to said body with the pin connectors received and retained within said holes in said body when said solderable securing and attachment means is in said second position;
• (ii) means for mounting the alignment apparatus, heat sink and electronic device package on a printed circuit board with the pin connectors of the electronic device package presented for soldering to preformed locations on the printed circuit board;
• and
• (c) means for releasably latching said solderable securing and attachment means to said body in said second position.