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US 4,707,402 AGranted
Formation of laminated structures by selective dielectric heating of bonding film
AssigneePhillips Petroleum Company
InventorAgmund K. Thorsrud
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Abstract
Multiple materials are bonded together by means of an RF-sensitized bonding film or sheet, wherein the RF-sensitized bonding film or sheet is inserted at an intermediate position adjacent to the multiple materials to be bonded, and exposed to a dielectric field for such period of time so as to effect fusion or sintering of the RF-sensitized bonding film or sheet to the multiple materials so as to bond the multiple materials together and form a laminated structure.
Claims13
A laminate comprising:
- at least two sheets wherein at least one of the sheets compriss a poly(arylene sulfide) resin;
- a bonding film intermediate the sheets so as to bond the sheets together;
- wherein of the sheets and bonding film only the bonding film is radio frequency sensitized.
A laminate consisting essentially of:
- at least one poly(arylene sulfide) sheets;
- at least one radio frequency sensitized bonding film intermediate each of the sheets so as to bond the sheets together, wherein only the bonding film is radio frequency sensitized.
Dependencies are inferred from the claim text.