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US 4,705,332 AGranted
High density, controlled impedance connectors
AssigneeCriton Technologies
InventorAmir-Akbar Sadigh-Behzadi
Life of this patent
Estimating the term…
Abstract
A high density electrical connector is shown in which discrete dielectric wafers mount several contact elements within grooves on a first surface of the wafer while mounting a single ground plane within a recess on a second surface. This configuration, when the wafers are stacked side-by-side, forms the contacts in a stripline connection in which the impedance of each contact may be controlled. The wafers may be inserted into slots within a housing to form a high density connector for joining a daughter board to a mother board.
Claims31
A high density electrical connector with controlled impedance, comprising:
- a plurality of discrete insulated wafers having generally flat sides;
- a plurality of first conductive elements for carrying electrical signals protectively mounted by each wafer;
- a single, second planar conductive element substantially covering said first elements and one of said wafer sides for connection to an electrical ground mounted only on one side of each wafer;
- said plurality of discrete wafers mounted in a stack wherein each single, second, planar conductive element mounted only on one side of each wafer is mounted on each side of said plurality of first conductive elements to form stripline connections therewith in a high density stack wherein the impedance of each of said first conductive elements is controlled.
1 more element
A high density electrical connector with controlled impedance, comprising:
- a plurality of discrete insulated wafers;
- a plurality of first conductive elements for carrying electrical signals protectively mounted by each wafer;
- a single, second conductive element for connection to an electrical ground mounted by each wafer;
- said plurality of discrete wafers mounted in a stack wherein each single, second conductive element mounted by each wafer is mounted on each side of said plurality of first conductive elements to form stripline connections in a high density stack;
- a first insulated housing having a plurality of slots therein for receipt of said wafers and said first and second conductive elements within each slot to form an elongated stack;
- a second housing having an elongated opening therein for receipt of said first insulated housing;
- and
- said second housing having means for mounting a first printed circuit board against a second printed circuit board.
5 more elements
A high density electrical connector with controlled impedance, comprising:
- a plurality of discrete insulated wafers;
- a plurality of first conductive elements for carrying electrical signals protectively mounted by each wafer;
- a single, second conductive element for connection to an electrical ground mounted by each wafer;
- mounting bracket means;
- spacer means;
- said plurality of discrete wafers mounted in a stack includes, in order, a mounting bracket means, a spacer means, a selected number of second conductive elements alternately stacked with a selected number of wafers having said first conductive elements mounted therein, there being one more second conductive element than said wafers in said stack, followed by a mounting bracket means;
- shaft means for retaining said stack in said order;
- first and second printed circuit boards having conductive pads thereon;
- said first and second conductive elements each having spring means for engaging said conductive pads;
- wherein each single, second conductive element mounted by each wafer is mounted on each side of said plurality of first conductive elements to form stripline connections in a high density stack between said conductive pads of said first and second printed circuit boards.
7 more elements
A high density electrical connector with controlled impedance, comprising:
- a plurality of discrete insulated wafers each having a first and second side;
- first conductive means for carrying electrical signals mounted on said first side;
- second, planar conductive means substantially covering said first conductive means and said wafer for connection to an electrical ground mounted only on said second side;
- said plurality of discrete wafers mounted in a side-by-side stack wherein said second conductive means mounted only on said second side are placed on each side of said first conductive means to form a high density stack of stripline connections for controlled impedance.
1 more element
A high density electrical with controlled impedance, comprising:
- a plurality of discrete insulated wafers each having a first and second side;
- first conductive means for carrying electrical signals mounted on said first side;
- second conductive means for connection to an electrical ground mounted on said second side;
- said plurality of discrete wafers mounted in a side-by-side stack wherein said second conductive means are placed on each side of said first conductive means to form a high density stack of stripline connections for controlled impedance;
- said discrete insulated wafers including a dielectric material having grooves in said first side and a recess in said second side;
- said first conductive means including a plurality of contact elements mounted within said grooves;
- said second conductive means including a single conductor plane mounted with said recess;
- a first insulated housing having a plurality of parallel slots therein for mounting said discrete wafers and said first and second conductive means in an elongated stack;
- a second housing having an elongated opening therein for receipt of first insulated housing;
- and
- said second housing having means for mounting a first printed circuit board against a second printed circuit board.
8 more elements
A high density electrical connector with controlled impedance, comprising:
- a plurality of discrete insulated wafers, having a first side with grooves therein and a second side with a recess therein;
- a plurality of first conductive means for carrying electrical signals mounted within said grooves in said first side of each wafer;
- a single, second planar conductive means for connection to an electrical ground mounted only on one side of said wafer within said recess in said second side of each wafer;
- an insulated housing having a plurality of parallel slots therein;
- individual wafers including said first and second conductive means mounted within each parallel slot of said insulated housing in a side-by-side stack wherein said second conductive means mounted only on one side of said wafers are placed on each side of said first conductive means to form a high density stack of stripline connections for controlled impedance.
2 more elements
A high density electrical connector for connection between printed circuit boards with controlled impedance, comprising:
- a plurality of discrete insulated wafers, having a first side with grooves therein and a second side with a recess therein;
- a plurality of first conductive means for carrying electrical signals mounted within said grooves in said first side;
- a plurality of second conductive means for connection to an electrical ground mounted within said recess in said second side;
- an insulated housing having a plurality of parallel slots therein;
- individual wafers including said first and second conductive means mounted within each parallel slot of said insulated housing in a side-by-side stack wherein said second conductive means are placed on each side of said first conductive means to form a high density stack of stripline connections for controlled impedance;
- and
- means for mounting printed circuit boards, including a second housing having an elongated opening therein for receiving said first mentioned housing.
4 more elements
Dependencies are inferred from the claim text.