System for sensing and forming objects such as leads of electronic components
AssigneeHewlett-Packard Company
InventorsJohn Birk, Heinz Breu, William Gong, Charles C. Morehouse, Sidney Liebes, Jr.
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AssigneeHewlett-Packard Company
InventorsJohn Birk, Heinz Breu, William Gong, Charles C. Morehouse, Sidney Liebes, Jr.
Estimating the term…
An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic compnents so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.
An apparatus for determining whether any leads of a first component having two or more leads with a lead configuration needs to be bent in order for all the leads to fit into predetermined holes in a second component, wherein the leads of the first component have approximately the same length, said apparatus comprising:
A method for determining whether any leads of a first component having two or more leads with a lead configuration needs to be bent in order for all the leads to fit into predetermined holes in a second component, wherein the leads of the first component are approximately of the same length, said method comprising:
An apparatus for bending one or more leads of a first component so that, after bending, the leads of the first component will fit simultaneously into predetermined holes in a second component, wherein the leads of the first component are approximately of the same length, said apparatus comprising:
A method for bending one or more leads of a first component so that, after bending, the leads of the first component will fit simultaneously into predetermined holes in a second component, wherein the leads of the first component are approximately of the same length, said method comprising:
An apparatus for determining whether any leads of a first component having two or more leads needs to be bent in order to fit into predetermined holes in a second component, said apparatus comprising:
Dependencies are inferred from the claim text.