Method for repair of opens in thin film lines on a substrate

A method of repairing at least one open gap in conductive thin film circuit lines on a substrate comprising:

• placing a metal repair film over the surface of said substrate with said metal repair film overlying at least one open gap in said circuit line;
• said metal repair film being at least the length of said open gap and at least the approximate thickness of said circuit lines;
• the length of any of said gaps being less than the distance between any adjacent circuit lines covered by said unpatterned metal repair film;
• heating said metal repair film to a temperature high enough to cause diffusion bonding of said metal film to said circuit line but less than the melting point of either said repair metal or said circuit line, thereby bridging said open gap therein;
• and
• exposing the area of the repair to ultrasonic energy in a liquid ambient for a time equal to at least the time required for said metal repair film overlying said substrate between adjacent circuit lines to be removed, and less than the time required to remove said metal repair film from underlying circuit lines and open gaps in said circuit lines;
• whereby only said repair film overlying circuit lines and open gaps in circuit lines remains.