Semiconductor device and manufacturing method therefor
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsKunito Sakai, Sadamu Matsuda, Takashi Takahama
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Abstract
A semiconductor device and a method for manufacturing a semiconductor device of a type having a resin package and a window in the package such as a quartz glass window transparent to ultraviolet rays. A semiconductor chip is bonded onto a surface of a die pad of a lead frame. A softened resin is then extruded from the opposite surface of the die pad through gaps between the die pad and the leads with the extrusion being carried out in an inert gas atmosphere. An inner package member is thus formed surrounding the semiconductor chip. An outer package member, made of a thermosetting resin having a weight ratio of resin to filler less than that of the inner package, is molded around the chip assembly and inner package.
Claims7
A semiconductor device comprising:
- a die pad (6) having a semiconductor chip (8) mounted on a first surface of the die pad;
- leads (7) separated by a gap from said die pad and connected through lead wires (9) to respective electrodes formed on a top surface of said semiconductor chip;
- a first, inner package number (10) of resin, said first package member forming an opening (11) above the first surface of said die pad, said resin filling the gaps between said leads and said die pad and covering a second, opposite surface of said die pad so that said semiconductor chip on said first surface of said die pad is peripherally surrounded by, but not in contact with, said first package member;
- an inert gas filling said opening;
- a second, outer package member (14) of a resin having a thermal expansion coefficient different from that of said resin forming said first package member, said second package member extending below and peripherally surrounding said first package member;
- and a cover member (12) sealingly closing said opening of said first package member.
Dependencies are inferred from the claim text.