Surface treatment apparatus
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsNobutoshi Ogami, Masaru Kitagawa
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AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsNobutoshi Ogami, Masaru Kitagawa
Estimating the term…
A surface treatment apparatus is composed of a supporting die for holding a substrate thereon to heat or cool the substrate; a cover capable of advancing close to the supporting die or into point-to-point contact with the supporting die to define a treatment space over the entire upper surface of the substrate on the supporting die, said cover defining a hole for the introduction of a surface treatment agent into the treatment space; and an evacuation chamber provided on the peripheral side wall of the supporting die, whereby the surface treatment agent is allowed to flow out from the treatment space into the evacuation chamber. No substantial conduction of heat takes place from the supporting die by way of the cover. The thermal distribution of the supporting die is thus kept extremely uniform, whereby each surface treatment can be conducted uniformly. Furthermore, owing to the provision of the evacuation chamber around the supporting die, the vaporized surface treatment agent is not allowed to escape into the room. The apparatus is effective in applying an adhesion-enhancing agent to a substrate so that the adhesion of a photoresist to the substrate is facilitated.
In an apparatus for processing a wafer substrate with an adhesion-enhancing agent, said apparatus including a heating or cooling plate having an upper surface for heating or cooling said substrate thereon, conveyer means for conveying said substrate to and from said plate, introducing means for introducing said adhesion-enhancing agent onto said substrate and an insulating housing provided above said plate, the improvement therein comprising:
A surface treatment apparatus comprising:
A surface treatment apparatus comprising:
A surface treatment apparatus comprising:
Dependencies are inferred from the claim text.