Back to results
US 4,688,151 AGranted
Multilayered interposer board for powering high current chip modules
AssigneeInternational Business Machines Corporation
InventorsCharles J. Kraus, Herbert I. Stoller, Leon L. Wu
Life of this patent
Estimating the term…
Abstract
A multilayered interposer powering board is disclosed for the distribution of required voltage levels to integrated circuit chip modules under conditions of high current demand and heat induced expansions. The interposer board is introduced between the module and its module mounting board. Flexible connector fingers are intermetallically or ohmically connected between a given level of the interposer board and a given power level of the module.
Claims6
An interposer board positioned between a multilayered module and a module mounting board,
- said module having a plurality of chip powering levels and signal path levels for servicing a plurality of semiconductor circuit chips,
- said interposer board comprising a plurality of insulated current-carrying conductive planes of greater conductivity than said powering levels of said module,
- groups of flexible contacting members,
- each said plane being apertured and receiving one of said groups of flexible contacting members, each member of the same group, at one end, being ohmically connected to a respective first location on a respective plane and, at the other end, to a respective second location on an associated powering level,
- said first locations being at a multiplicity of points throughout the surface area of the respective plane.
2 more elements
Dependencies are inferred from the claim text.