Composite compact having a base of a hard-centered alloy in which the base is joined to a substrate through a joint layer and process for producing the same
AssigneeSumitomo Electric Industries, Ltd.
InventorsAkira Hara, Masaya Miyake, Shuji Yazu
Life of this patent
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Abstract
A composite compact component made of a composite compact consisting of a diamond or BN powder bonded to a hard sintered alloy base during a sintering operation, and a substrate composed of steel or a hard sintered alloy bonded to the base of the composite compact through a high strength filler metal or alloy having a melting point of at least the liquidus point of the hard sintered alloy base. A process of making set composite compact component is also disclosed as well as a drill bit containing said composite compact component and variations thereof.
Claims7
A process for the production of a composite compact component, which comprises sandwiching a thin sheet of a high strength metal or alloy, as a filler metal, having a thickness of at most 2 mm between the end of a base of a composite compact and the end of a substrate of a hard sintered alloy or steel having a larger volume than the base, the composite compact consisting of a diamond or BN compact containing at least 50% by volume of diamond or BN powder and the base of a hard sintered alloy bonded during sintering under an ultra-high pressure and high temperature directly or through an interlayer with a thickness of at most 0.5 mm to the diamond or BN compact, then heating and melting the thin sheet at a temperature of at least the liquidus point of the hard sintered alloy by a high energy electron or laser beam and thereby welding or bonding the base and substrate;
- said hard senitered alloy consisting of at least one member selected from the group consisting of carbides, carbonitrides, nitrides and carboxynitrides of Ti, Zr, Hf, Cr, V, Nb, W, Mo, and Ta and solid solutions thereof, bonded by at least one member selected from iron group metals, and wherein the filler metal has a melting point at least as high as that of the liquidus point of the hard sintered alloy.
A process for the production of a composite compact component, which comprises forming a projection or a hollow at the end of a base of a composite compact consisting of a diamond or BN compact containing at least 50% by volume of diamond or BN powder and a base of a hard sintered alloy bonded during sintering under an ultra-high pressure and high temperature directly or through an interlayer with a thickness of at most 0.5 mm to the diamond or BN compact, forming a hollow or a projection at the end of a substrate consisting of a hard sintered alloy or steel and having a larger volume than the base, sandwiching a ring-shaped thin sheet of a high strength metal or alloy, having a thickness of at most 2 mm between the base and substrate, then heating and melting the thin sheet at a temperature of at least the liquidus point of the hard sintered alloy by a high energy electron or laser beam and thereby welding or bonding the base and substrate, said sintered alloy consisting of at least one member selected from the group consisting of carbides, carbonitrides, nitrides and carboxynitrides of Ti, Zr, Hf, Cr, V, Nb, W, Mo and Ta and solid solutions thereof, bonded by at least one member selected from iron group metals.
A process for the production of a composite compact component, which comprises sandwiching a powder, green compact or sintered body of a hard sintered alloy, as a filler, between the end of a base of a composite compact and the end of a substrate of a hard sintered alloy having larger volume than the base, the composite compact consisting of a diamond or BN compact containing at least 50% by volume of diamond or BN powder and a base of a hard sintered alloy bonded during sintering under an ultra-high pressure and high temperature directly or through an interlayer with a thickness of at most 0.5 mm to the diamond or BN compact and the hard sintered alloy of the filler having a larger content of an iron group metal than the hard sintered alloys of the base and substrate, then heating and melting the filler by a high energy electron or laser beam and thereby welding or bonding the base and substrate, said sintered alloy consisting of at least one member selected from the group consisting of carbides, carbonitrides, nitrides and carboxynitrides of Ti, Zr, Hf, Cr, V, Nb, W, Mo and Ta and solid solutions thereof, bonded by at least one member selected from iron group metals.
A process for the production of a composite compact component, which comprises contacting the end of a base of a composite compact consisting of a diamond or BN compact containing at least 50% by volume of diamond or BN powder and the base of a hard sintered alloy bonded during sintering under an ultra-high pressure and high temperature directly or through an interlayer with a thickness of at most 0.5 mm to the diamond or BN compact with a substrate of steel having a larger volume than the base, applying a high energy electron or laser beam in such a manner that both the contacted surface of the base and substrate is irradiated, thereby melting the contacted surface of the steel substrate and welding and bonding the base and substrate, said sintered alloy consisting of at least one member selected from the group consisting of carbides, carbonitrides, nitrides and carboxynitrides of Ti, Zr, Hf, Cr, V, Nb, W, Mo and Ta and solid soluions thereof, bonded by at least one member selected from iron group metals.
Dependencies are inferred from the claim text.