IC carrier system

Abstract

A method of laser-machining IC carrier bodies from a sheet ceramic blank, and the IC carrier products produced from such laser-machining. The ceramic blank, preferably of alumina or beryllia, is high temperature fired to permanently fix its size and shape prior to the laser-machining, permitting a matrix of IC carrier bodies to be laser-machined to close tolerances, whereby metallization conductors can be located on the bodies also to close tolerances, and lower temperature firing may be employed to fix such conductors without disturbing any of the tolerances. Novel elongated peripheral groove vias in the carrier bodies permit the sequential laser-machining of elongated slots to form the via grooves and scribe recesses. The novel elongated slot via grooves permit efficient vacuum drawing of metallization paste through the slots and restriction of the metallization to flat sides of the slots whereby insulative slot ends enable all carriers in a matrix to be electrically isolated for multiple electrical testing of the carriers in matrix or array form.

Dependencies are inferred from the claim text.