Method and apparatus for vacuum deposition plating

Abstract

A vacuum deposition plating apparatus having an inlet-side vacuum sealing device provided in front of a vacuum deposition plating chamber, an inlet-side inactive gas replacement chamber provided between the inlet-side vacuum sealing device and an annealing furnace, an outlet-side vacuum sealing device provided in the rear of the vacuum deposition plating chamber, an outlet-side inactive gas replacement chamber provided between the outlet-side vacuum sealing device and the atmosphere, and an inactive gas circulating/purifying device for circulating an inactive gas from vacuum chambers of both the vacuum sealing devices to atmospheric pressure chambers of both the vacuum sealing devices and for removing water, oil and oxygen from the inactive gas; a pressure gauge provided on the annealing furnace; a pressure gauge, a control valve, an automatic valve, a hydrogen concentration detector and a discharge valve provided on the inlet-side inactive gas replacement chamber; a pressure gauge and an automatic valve provided on the outlet-side inactive gas replacement chamber; and an automatic valve connecting to an inactive gas tank for emergency provided on the atmospheric pressure chambers of both the vacuum sealing devices.

Dependencies are inferred from the claim text.