Die machining apparatus in automatic programming
AssigneeHitachi Seiki Co., Ltd.
InventorsTadashi Ookuma, Shigeshi Murata
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Abstract
This invention has improved the automatic programming method which is used for machining the configuration of a curved surface of a die. The values of X and Y coordinates are calculated by a machining path production device through a curved surface configuration storage device. The value of Z coordinate in the third dimension is obtained by a machining point calculation device. If a curved surface in the Z axis is to be machined two or more times, a judgement circuit decides this and a calculation processing device calculates that the first machining is to be conducted in conformity with the curved surface and the second or later machining is to be skipped for rapid feeding, this decision being stored in a tool path data storing device.
Claims1
A die machining apparatus in automatic programming comprising:
- a machining data input device for inputting data as to the configuration of a curved surface, machining modes and machining conditions;
- a machining path production device for calculating two dimensional coordinate values which are projected from a curved surface configuration storage device;
- a machining point calculation device for calculating three dimensional coordinate values;
- a judgement circuit which decides in the case of machihing a curved surface that is duplicated in two or more machining steps that said curve is to be machined in the first step and that in later steps said curve is to be skipped for fast feeding;
- a calculation processing means for calculating a machining data for each judgement produced by said judgement circuit;
- and
- an output device for outputting said data as NC data through a tool offset processing device and a tool path data storage device.
Dependencies are inferred from the claim text.