Method for achieving chip separation while machining work pieces

Abstract

Chip separation is assured while turning work pieces, by causing an oscillating movement of the turning or lathe tool during the work piece rotation. The tool oscillation is controlled in response to the work piece rotation and so that the tool oscillates periodically along or rather relative to a line defined by the feed advance vectors of the tool movement. The oscillation amplitude corresponds approximately to half the effective feed advance path for each work piece revolution. The wave length of the oscillation has a magnitude such that it itself or an integral multiple thereof, plus a half wave length, is equal to the momentary respective work piece circumference at the instantaneous point of contact between the tool and the work piece. Several ways are possible for imparting an oscillating movement to the tool support or tool supports.

Dependencies are inferred from the claim text.