Thermal cut-out device for radiant heaters
AssigneeMicropore International Limited
InventorJoseph A. McWilliams
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AssigneeMicropore International Limited
InventorJoseph A. McWilliams
Estimating the term…
A thermal cut-out device for a radiant heater includes a probe-type thermally responsive assembly (2), at least a part of which is coated with and/or is surrounded by a radiation reflective material. The probe-type assembly may include a first element (3) in the form of a rod of material having a relatively high coefficient of thermal expansion and a second element (4) in the form of a tube of material having a relatively low coefficient of thermal expansion. The rod may be coupled to a snap-acting switch assembly (1). One or both of the first and second elements may be coated with or surrounded by the radiation reflective material. Alternatively the tube which surrounds the first element may be made of the radiation reflective material. The radiation reflective material may be a metal such as gold or a suitable element from Group VIII of the Periodic Table or may be a high temperature resistant particulate material such as aluminium oxide, magnesium oxide, titanium dioxide or tin oxide.
A thermal cut-out device for a radiant heater, comprising:
A thermal cut-out device for a radiant heater, which thermal cut-out device comprises a snap-acting switch assembly and a probe-type thermally responsive assembly comprising:
A thermal cut-out device for a radiant heater, which thermal cut-out device comprises a snap-acting switch assembly and a probe-type thermally responsive assembly comprising:
A thermal cut-out device for a radiant heater, which thermal cut-out device comprises a snap-acting switch assembly and a probe-type thermally responsive assembly comprising:
A thermal cut-out device for a radiant heater, which thermal cut-out device comprises a snap-acting switch assembly and a probe-type thermally responsive assembly comprising:
Dependencies are inferred from the claim text.