Stackable integrally molded receptacle

A unitary, molded receptacle arranged to be stacked on a second and similarly constructed receptacle, said receptacle comprising a cavity having a longitudinal axis and an opening, said cavity being defined between a pair of vertical side walls, a top wall and a bottom wall, said walls being joined at their marginal edges, each of said walls having a front portion and a rear portion, said receptacle opening being located adjacent said front portion of said side walls, the height of said side walls contiguous with said cavity tapering from front to rear at an acute angle to said axis so that the cavity portion contiguous with the rear portion of said top and bottom walls is of lesser height than the cavity portion contiguous with the front portion of the top and bottom walls, and upper and lower pairs of support ribs, each rib of said upper pair projecting up from said receptacle contiguous with a respective on of said and with a portion of said top wall, each rib of said lower pair projecting down from said receptacle contiguous with a respective one of said side walls and with a portion of said bottom wall, each of said ribs including at least one surface compensating for said tapered side walls, with the compensating surface of each of said ribs being parallel to one another, the compensating surface of each of the lower pair of ribs of said receptacle being arranged to engage and mate with the compensating surface of each of the upper pair of ribs of said second receptacle, thereby enabling said receptacle to be stacked on said second receptacle so that the sidewalls of said first and second receptacle are in vertical alignment and said first and second receptacles being resistant to lateral displacement therebetween.