Electric work-in-circuit metal-bonding heating tool

A low-voltage, high-ampeage, work-in-circuit metal bonding tool comprising a pair of elongated handles of rigid electrically insulating material, each of said handles having a hollow hand-grip portion open at each end and an external radially extending web, said webs being pivotally joined to each other to form a hinge between a proximal end and a distal end of the handles for permitting the distal ends to move toward and away from each other, a power supply cable entering the proximal end of each said hand-grip portion, a rigid solid conductor bar within each said hand-grip portion and electrically joined therein to said cable, said conductor bar extending out from said hand-grip portion at the distal end thereof, an annular external flange on said conductor bars in spaced relationship to the distal ends of said hand-grip portions, an axial electrically insulating sleeve within each said grip portion between said conductor bar and said hand-grip portion, annular thermal insulating means between each said flange and the distal end of each said hand-grip portion, a mounting peg on the distal end of each of said bars and an electrode assembly detachably mounted on each said mounting peg and including a member adapted to make electrical contact with a metal workpiece to be heated, and a spring in cooperating relation to said hinge to urge the distal ends of said handles toward each other.