Spin drying apparatus

Spin drying apparatus for drying a plate-like element, said apparatus comprising a shaft arranged for rotary motion and having a drive motor at one end and a rotating head assembly at the other end thereof,

• said head assembly comprising a head element coaxially arranged at said other end of said shaft and having a plurality of radial arms extending outwardly therefrom,
• a plurality of T-shaped arms pivotally connected one to each of said radial arms, said T-shaped arms each having an axially extending plate-engaging leg portion, and a radially extending leg portion that extends into said head element,
• actuating means including an actuator rod disposed within said shaft and means in said head element for engaging the inner ends of said T-shaped arms,
• biasing means for biasing said actuating means towards said motor to move said plate-engaging leg portions of said T-shaped arms to a plate-engaging position,
• means for moving said actuating means against the force of said biasing means to move said plate-engaging leg portions from said plate-engaging position,
• first containment means surrounding said rotating head assembly and having an open upper end, said first containment means having a downwardly and outwardly sloping intermediate portion adjacent said plate-engaging leg portion of said T-shaped arms,
• second containment means closely and stationarily disposed about said rotating arms and spaced inwardly from the lower portion of said first containment means, said second containment means terminating at an upper end just above said pivotal connection between said arms,
• a cover element for said second containment means connected to and extending from said head assembly outwardly beyond the axially extending plate-engaging leg portions of said T-shaped arms and terminating in close proximity to the upper end of said second containment means whereby said second containment means and said cover element substantially eliminate the generation of air flow around said plate-like element by the rotation of said head assembly, and
• means for elevating said rotating head assembly to a position wherein said plate-engaging leg portions are disposed above the open upper end of said first containment means.

Spin drying apparatus for drying a semiconductor wafer, said apparatus comprising a vertical hollow shaft arranged for rotary motion and having a drive motor at the lower end and a rotating head assembly at the upper end thereof,

• said head assembly comprising a hollow head element coaxially arranged at the upper end of said hollow shaft and having a plurality of pairs of spaced radial arms extending outwardly therefrom,
• a plurality of T-shaped arms disposed one between each pair of arms and pivotally connected to the outer ends thereof, said T-shaped arms each having an axially extending wafer-engaging leg portion, the other leg of each of said T-shaped arms extending radially between said pairs of said radial arms into said head element,
• actuating means including an actuator rod disposed coaxially within said hollow shaft and means in said head element for engaging the inner ends of said T-shaped arms,
• biasing means for biasing said actuating means coaxially of said shaft towards said motor to move said wafer-engaging leg portions toward the center of said head assembly to a wafer-engaging position,
• pin means disposed through the lower end of said actuator rod and extending outwardly through said shaft and connected to a collar,
• fork means disposed about said shaft and arranged to selectively engage said collar, actuator means arranged to move said fork axially of said shaft to engage said collar and to move said actuating means upwardly against the force of said biasing means thereby moving said wafer-engaging leg portions outwardly from said wafer-engaging position,
• first containment means peripherally surrounding said rotating head assembly and having an open upper end with a diameter greater than the diameter of said rotating head assembly, said first containment means having a downwardly and outwardly sloping intermediate portion adjacent said wafer-engaging leg portion of said T-shaped arms, drain means disposed in the lower portion said first containment means,
• second containment means closely and stationarily disposed about said rotating arms and spaced inwardly from the lower portion of said first containment means, said second containment means terminating at an upper end just above said pivotal connection between said arms,
• a cover element for said second containment means connected to and extending from the center of said head assembly outwardly beyond the axially extending wafer-engaging leg portions of said T-shaped arms and terminating in close proximity to the upper end of said second containment means whereby said second containment means and said cover element substantially prevent air flow around said wafer generated by the rotation of said head assembly,
• said T-shaped arms being provided with counterweights disposed on the opposite side of said pivotal connections from said wafer-engaging leg portions, said counterweights providing a centrifugal force upon rotation of said head assembly that substantially equals or slightly exceeds the centrifugal force on said wafer-engaging leg portions during rotation whereby the centrifugal force of said counterweights tends to cause said wafer-engaging leg portions to grip said plate member,
• means for elevating said rotating head assembly to a position wherein said wafer-engaging leg portions are disposed above the open upper end of said first containment means, and
• a first pair of nozzle means for directing a liquid onto both surfaces of said wafer during a first portion of the spin cycle, and
• a second pair of nozzle means for directing an inert gas onto both surfaces of said wafer during a second portion of the spin cycle.