US 4,647,148 AGranted

Fiber optic receiver module

AssigneeTokyo Shibaura Denki Kabushiki Kaisha

InventorShuhei Katagiri

Life of this patent

Estimating the term…

Loading patent…

Abstract

A fiber optic receiver module comprises a substrate and circuit elements (i.e., IC and resistors, etc.) mounted on the substrate. The IC are electrically connected by bonding wires and bonding pads to input and output conductive patterns extending within the substrate. The leads of a photodetector are electrically connected to the input lines of the IC by pads formed on the substrate and the input conductive pattern. The output terminals of the module are connected to the output terminals of the IC by the output conductive pattern. Conductive layers are formed within the substrate. They are held at ground potential. The input and output conductive patterns are shielded from one another by these conductive layers. The circuit elements are shielded from the outside by a seal ring and a conductive shell both fixed to the upper surface of the substrate. The photodetector is located within a space defined by the seal ring, a metal cover covering the ring, a receptacle and a metal plate secured to the lower surface of the substrate. Hence, this element is shielded from the circuit elements and the output terminals of the module.

Claims4

Dependent claims

A fiber optic receiver module comprising:

a substrate;
receiver circuit elements including an IC chip mounted on said substrate;
output terminals attached to said substrate;
an output conductive pad formed on said substrate;
first input conductive pads formed on said substrate;
a second input conductive pad formed on said substrate;
a photodetector having lead wires connected to said first input conductive pads;
a first bonding wire connecting said output conductive pad and said IC chip;
a second bonding wire connecting said second input conductive pad and said IC chip;
a first conductive pattern formed in said substrate and connecting one of said first input conductive pads and said second input conductive pad;
a second conductive pattern formed in said substrate and connecting said output conductive pad and one of said output terminals;
a conductive layer formed in said substrate, held at ground potential, and covering said first and second conductive patterns respectively to separate said first and second conductive patterns;
a first conductive shield housing connected to said conductive layer, for shielding said photodetector from said second bonding wire, said second input conductive pad, said IC chip and said second conductive pattern;
and
a second conductive shield housing connected to said conductive layer, for shielding said photodetector and the lead wires thereof from said output terminals.

12 more elements

Dependencies are inferred from the claim text.