Solderless connector technique
AssigneeRogers Corporation
InventorsVincent R. Landi, Edwin R. Rowlands
Life of this patent
Estimating the term…
Abstract
A solderless connector especially suited for interconnecting a flexible circuit to another circuit or component, either rigid or flexible, is presented. The solderless connector of the present invention utilizes the pressure mating of contact areas with the added advantage of a wiping or cleaning action on the contacting surfaces. In one embodiment of the present invention, this wiping action is achieved by bending or crimping the two layers adjacent to the contact areas, thereby causing them to have mutual relative sliding motion over each other as they are being pressed into contact therebetween. In another embodiment, the bending or crimping of the flexible circuit layers is accomplished in the structure of the solderless connector itself.
Claims13
In a solderless connector wherein clamp frame means applies force against an elastomeric element distributing the force to thereby effect electrical contact or mating between terminal portions of circuit devices, at least one of the circuit devices being a flexible circuit device, and wherein the clamp frame means includes a pair of rigid plate means, the improvement comprising:
- means incorporated in at least one of said rigid plate means for bending at least one of the flexible circuit devices to be connected, said bending means providing relative wiping between said terminal portions of said circuit devices;
- alignment means extending from said rigid plate means;
- and
- said circuit devices including openings therethrough for receiving said alignment means, said openings being larger than said alignment means;
- wherein said alignment means precludes lateral movement between said circuit devices but allows relative motion and wiping between said terminal portions of said circuit devices.
Dependencies are inferred from the claim text.