System for controlling drive of a wafer stage
AssigneeCanon Kabushiki Kaisha
InventorsShigemoto Tazawa, Naoki Ayata
Life of this patent
Estimating the term…
Abstract
A system for controlling drive of a movable member for carrying a workpiece such as a semiconductor wafer, the system including a first servo control system effective to move the workpiece carrying member at a relatively high speed and with a relatively low positional accuracy for stoppage of the workpiece carrying member, a second servo control system effective to move the workpiece carrying member at a relatively low speed and with a relatively high positional accuracy for the stoppage of the workpiece carrying member, and a system for selecting one of or a combination of the first and second servo control system in accordance with a positional accuracy required with respect to a target position of the workpiece carrying member.
Claims38
A system for controlling a drive of a movable member for carrying a workpiece, said system comprising:
- first servo control means for moving the workpiece carrying member at a relatively high speed and for stopping the workpiece carrying member with a relatively low positional accuracy relative to a target position;
- second servo control means for moving the workpiece carrying member at a relatively low speed and for stopping the workpiece carrying member with a relatively high positional accuracy relative to the target position;
- and
- means for selecting one of or a combination of said first and second servo control means in accordance with the positional accuracy required of the workpiece carrying member with respect to the target position;
- wherein said first servo control means includes means for setting the desired moving speed of the workpiece carrying member in accordance with a speed pattern that is substantially trapezoidal in shape, and wherein said first servo control means further includes means for controlling the moving speed of the workpiece carrying member in accordance with the speed pattern set by said setting means.
A system for controlling a drive of a movable member for carrying a workpiece, said system comprising:
- first servo control means effective for moving the workpiece carrying member at a relatively high speed and for stopping the workpiece carrying member with a relatively low positional accuracy relative to a target position;
- second servo control means effective for moving the workpiece carrying member at a relatively low speed and for stopping the workpiece carrying member with a relatively high positional accuracy relative to the target position;
- and
- means for selecting one of or a combination of said first and second servo control means in accordance with the positional accuracy required of the workpiece carrying member with respect to the target position;
- wherein said first servo control system comprises means for detecting a moving speed of the workpiece carrying member and means for controlling the moving speed, acceleration and deceleration of the workpiece carrying member in response to an output of said moving speed detecting means.
A system for controlling a drive of a movable member for carrying a workpiece, said system comprising:
- first servo control means for moving the workpiece carrying member at a relatively high speed and for stopping the workpiece carrying member with a relatively low positional accuracy relative to a target position;
- second servo control means for moving the workpiece carrying member at a relatively low speed and for stopping the workpiece carrying member with a relatively high positional accuracy relative to the target position;
- and
- means for selecting one of or a combination of said first and second servo control means in accordance with a kind of process to be effected relative to the workpiece.
A system for controlling a drive of a movable member for carrying a workpiece, said system comprising:
- means for controlling a stopping position of the workpiece carrying member with a predetermined positional tolerance relative to a target position at which the workpiece carrying member is to be placed;
- and
- means for variably setting the predetermined positional tolerance of the stopping position of the workpiece carrying member relative to the target position.
A system for controlling a drive of a stage for carrying a wafer, for use in an integrated circuit manufacturing exposure apparatus including aligning means for moving the wafer and a reticle relative to each other so as to bring them into alignment, said system comprising:
- means for controlling a stopping position of the stage carrying the wafer with a predetermined positional tolerance;
- and
- means for variably setting the predetermined positional tolerance of the stopping position of the stage, said variably setting means adapted to set a different positional tolerance with respect to a first exposure step to be effected relative to the wafer, as compared with a positional tolerance to be set by said variably setting means with respect to a second exposure step in which the exposure of the wafer is effected after completion of the alignment between the wafer and the reticle by the aligning means.
A system for controlling a drive of a stage for carrying a wafer, for use in an integrated circuit manufacturing exposure apparatus including aligning means for moving the wafer and a reticle relative to each other so as to bring them into alignment prior to initiation of a first movement of the stage, said system comprising:
- means for controlling a stopping position of the stage carrying the wafer with a predetermined positional tolerance;
- and
- means for variably setting the predetermined positional tolerance of the stopping position of the stage;
- wherein, with respect to a particular exposure step of a plurality of exposure steps to be made relative to the same region of the wafer, said variably setting means is adapted to set a positional tolerance for the particular exposure step different from the positional tolerances set by said variably setting means with respect to the other exposure steps.
A method of controlling a drive of a stage for carrying a wafer, comprising the steps of:
- placing the wafer on the stage;
- moving the stage with a first servo control that is capable of moving the stage at a relatively high speed and stopping the stage with a relatively low positional accuracy relative to a stopping position;
- moving the stage with a second servo control that is capable of moving the stage at a relatively low speed and stopping the stage with a relatively high positional accuracy relative to a stopping position;
- and
- selecting one of or a combination of the first and second servo-controlled movements in accordance with the positional accuracy required with respect to a target position of the stage;
- wherein the step of moving the stage with the first servo control includes setting the desired moving speed of the stage in accordance with a speed pattern that is substantially trapezoidal in shape, and controlling the moving speed of the stage in accordance with the speed pattern.
A method of controlling a drive of a stage for carrying a wafer for manufacturing an integrated circuit, said method comprising the steps of:
- placing the wafer on the stage;
- and
- selecting in sequence plural positional tolerances for a positional accuracy of a stopping position of the stage.
A system for controlling a drive of a movable member for carrying a workpiece, said system comprising:
- first servo control means for moving the workpiece carrying member at a relatively high speed and for stopping the workpiece with a relatively low positional accuracy relative to a target position;
- second servo control means for moving the workpiece carrying member at a relatively low speed and for stopping the workpiece carrying member with a relatively high positional accuracy relative to the target position;
- and
- means for selecting one of or a combination of said first and second servo control means in accordance with a kind of process to be effected relative to the workpiece;
- wherein said first servo control means includes means for setting the desired moving speed of the workpiece carrying member in accordance with a speed pattern that is substantially trapezoidal in shape, and wherein said first servo control means further includes means for controlling the moving speed of the workpiece carrying member in accordance with the speed pattern set by said setting means.
Dependencies are inferred from the claim text.