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US 4,639,277 AGranted
Semiconductor material on a substrate, said substrate comprising, in order, a layer of organic polymer, a layer of metal or metal alloy and a layer of dielectric material
AssigneeEastman Kodak Company
InventorGilbert A. Hawkins
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Abstract
There is disclosed a substrate having thereon a layer of a semiconductor material, and a method for depositing and heating the semiconductor material on the substrate, wherein the substrate comprises a layer of organic polymer, a layer of metal or metal alloy, and a layer of dielectric material wherein the layer of dielectric material has a surface, remote from the metal, that is contiguous with the semiconductor material.
Claims4
A substrate having thereon a layer of semiconductor material containing one or more majority carrier semiconductor devices, said substrate comprising, in order,
- a layer of organic polymer;
- a layer of metal or metal alloy;
- and a layer of dielectric material completely isolating said metal or metal alloy later from said semiconductor material;
- said dielectric layer and said metal or metal alloy layer together having thickness that are sufficient to disipate the heat that occurs when said semiconductor material is heated to 1000.degree. C., without causing significant decomposition or thermal expansion of said polymer layer.
1 more element
Dependencies are inferred from the claim text.