General technique for the integration of MIC/MMIC'S with waveguides
AssigneeCommunications Satellite Corporation
InventorsBernard D. Geller, Amir I. Zaghloul
Life of this patent
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Abstract
A technique for packaging and integrating of a microwave integrated circuit (MIC) or monolithic microwave integrated circuit (MMIC) with a waveguide uses a printed conductive circuit pattern on a dielectric substrate to transform impedance and mode of propagation between the MIC/MMIC and the waveguide. The virtually coplanar circuit pattern lies on an equipotential surface within the waveguide and therefore makes possible single or dual polarized mode structures.
Claims14
A microwave transition device for coupling a waveguide and a microwave integrated circuit, said transition device being located within said waveguide for alignment with an electric field having microwave energy, said device comprising:
- a dielectric substrate having a metallized surface on only one side thereof;
- a unilateral finline formed in said metallized surface at an end portion of said substrate;
- a slotline formed adjacent to said finline on said metallized surface and connected to said finline at one end thereof;
- and a balun positioned proximate to said slotline, said microwave integrated circuit being attached to said metallized surface and connected to said balun, wherein said balun comprises a portion of said slotline equal in length to 1/4 of the wavelength of the electric field and a wire bond, passing over said portion of said slotline, and connected at one end to said microwave integrated circuit and at an opposite end to said metallized surface.
Dependencies are inferred from the claim text.