US 4,628,991 A · Wafer scale integrated circuit testing chuck

Abstract

A testing chuck for providing a thermally controlled mounting for wafer scale integrated circuits includes a body having a flat upper surface, upon which the integrated circuit is mounted, cooled or heated by a fluid flowing through a number of channels formed in the body. The channels have entrance and exit ends fluidly connected to first entrance and exit plenums. Second entrance and exit plenums are connected to the first entrance and exit plenums by a number of entrance and exit distribution conduits. Fluid is pumped into the second entrance plenum, through the entrance distribution conduits, through the first entrance plenum and into the entrance ends of the channels. After passing through the channels, the fluid flows through the first exit plenum, exit distribution conduits and second exit plenum. The entrance and exit plenums are curved in the direction of fluid flow to reduce stagnant regions within the plenums to aid heat transfer and draining of the chuck. The use of two plenums coupled by appropriately sized and positioned distribution conduits at both ends of the channels ensures that the proper amount of fluid flows through each channel.

Claims13

Dependent claims

A heat sink for cooling a semiconductor device mounted thereto comprising:

a heat sink body having a flat upper surface upon which the semiconductor device is mounted;
said body defining a plurality of straight channels therein, the channels oriented parallel to the upper surface and having entrance and exit ends;
entrance and exit distribution networks fluidly coupled to the entrance and exit ends, said entrance and exit distribution networks arranged and adapted to achieve a desired flow of a fluid through the channels, said entrance distribution network comprising:
a first entrance plenum formed in said heat sink body and fluidly coupled to said entrance ends of said channels for distribution of the fluid to said channels;
a second entrance plenum formed in said heat sink body;
and a plurality of entrance distribution conduits fluidly coupling said first entrance plenum with said second entrance plenum;
and
first means for directing the fluid to said second entrance plenum;
second means for directing the fluid from said exit distribution network.

6 more elements

Dependencies are inferred from the claim text.

Wafer scale integrated circuit testing chuck

Life of this patent

Wafer scale integrated circuit testing chuck

Life of this patent

Abstract

Claims13