Ceramic package for compensated crystal oscillator

An intermediate for processing into a ceramic package for a compensated crystal oscillator, said intermediate comprising upper and lower plastic ceramic bodies of rectangular configuration of substantially the same size and each having a first and a second opening therein, said upper body and said lower body each being of substantially uniform thickness away from said openings;

• a center plate of plastic ceramic material, said center plate being of substantially rectangular configuration substantially the same size as said upper and lower bodies, said center plate having an opening therein which is in alignment with said second opening in said upper and lower bodies and out of alignment with said first openings in said upper and lower bodies, said center plate having electrically conductive material deposited thereon in desired conductive paths, including two paths from adjacent said opening in said center plate, so that said upper body, said center plate and said lower body can be stacked in substantial alignment and vitrified to form a single ceramic package for a compensated crystal oscillator wherein said package has three open cavities therein.