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US 4,626,872 AGranted
Thermal print head
AssigneeKabushiki Kaisha Toshiba
InventorShozo Takeno
Life of this patent
Estimating the term…
Abstract
A thermal print head comprises a heat resisting resin film and resistive heating layers and metal circuit layers on the film, the metal circuit layers connected to the resistive heating layers respectively. The film is supported on a heat sink substrate provided with a flat surface and corner sections formed at the both sides of the flat surface, the resistive heating layers positioned over the flat surface. The heat sink substrate supports the film to prevent the resistive heating layers from electrical resistance value fluctuation due to bending of the film.
Claims11
A thermal print head comprising:
- a heat sink substrate having a flat surface with corners extending along both sides thereof;
- a heat resisting organic resin film sheet formed on the flat surface and folded at the corners;
- resistive heating layers comprising a plurality of resistive heating elements deposited on an area of the film sheet on the flat surface;
- metal circuit layers extending on the film sheet electrically connected to the resistive heating layers respectively;
- and
- integrated circuits mounted on the substrate at a position spaced from said flat surface and electrically connected to the metal circuit layers,
- wherein the resistive heating layers are kept flat supported without bending.
4 more elements
Dependencies are inferred from the claim text.