Method and apparatus for separating printed-circuit boards from multi-board panels

Abstract

The instant invention is particularly directed to a method and apparatus for automated handling of panels comprising a plurality of interconnected substrates in order to control and separate the circuit boards in a continuous processing line. One embodiment incorporates two shearing stations and a rotary transfer device therebetween in order to transfer a panel portion from the first station to the second station while controlling and rotating the panel for subsequent feed to the second station such that the panel portion is cut on a line of the substrate which is perpendicular to the original line of cut of the substrate. Throughout the handling of the panels and panel portions, sensing, gripping, and indexed feeding of the panels and panel portions are under the control of a programmable computer.

Dependencies are inferred from the claim text.