Monolithic capacitor edge termination
AssigneeSFE Technologies
InventorsMooyoung Ham, John W. Duffy
Life of this patent
Estimating the term…
Abstract
Edge termination of monolithic capacitors having thin electrode layers bonded in dielectric resin is accomplished by ashing away some resin to expose electrode edge surfaces, plating the edge surfaces by vapor deposition, and depositing a conductive layer on the coating by electroless plating, schooping or applying conductive epoxy.
Claims7
The method of edge termination for a monolithic capacitor in which the electrode layers are bonded in spaced relation by dielectric resin comprising the steps of ashing the substantially planar capacitor edge in an oxygen plasma to remove dielectric between the electrode layers and expose narrow electrode surfaces, vapor depositing a film of metal onto said edges so as to coat and electrically connect said narrow electrical surfaces, and overlaying a layer of conductive material onto said metal coating.
In a miniature monolithic capacitor having electrode layers about 200 to 500 angstroms thick bonded in spaced relation by dielectric resin layers about one to one and a half microns thick, an edge termination structure comprising, in combination, an outer layer of electrically conductive material having one surface exposed to define an electrical termination surface, said electrode layers extending from said resin layers and defining narrow electrode surfaces disposed approximately perpendicular to said termination surface, and a film of metal disposed between and coating both said narrow electrode surfaces and said layer of conductive material so as to electrically and physically connect the same.
Dependencies are inferred from the claim text.