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US 4,610,774 AGranted
Target for sputtering
AssigneeHitachi, Ltd.
InventorsMasao Sakata, Shigeru Kobayashi, Katsuo Abe, Hideaki Shimamura, Tsuneaki Kamei, Osamu Kasahara, Hidetsugu Ogishi, Takeshi Oyamada
Life of this patent
Estimating the term…
Abstract
A sputtering target structure suitable for use with a planar magnetron sputtering electrode device has a plurality of annular target members arranged concentrically. The annular target member is provided with either an annular groove for concentration of an electric field or an annular wall for repelling electrons.
Claims7
A target for sputtering based on magnetron discharge having a plurality of annular target members arranged concentrically with respect to a rotational symmetry axis, said target comprising:
- at least one of annular projection projecting beyond a surface of a target member, forming a repellent face of electron and annular recess provided for a target member, for concentration of an electric field.
Dependencies are inferred from the claim text.