Sintered polycrystalline diamond compact construction with integral heat sink
AssigneeGeneral Electric Company
InventorsLouis E. Hibbs, Jr., George C. Sogoian
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Abstract
A sintered polycrystalline diamond compact having an integral metallic heat sink bonded to and covering at least the outer diamond surface is used to increase compact life when the compact is used for material removal without a fluid coolant.
Claims6
In a composite tool insert construction in which a layer of sintered polycrystalline diamond is supported on and bonded to a cemented carbide substrate, the improvement comprising a metallic heat sink layer having a thickness between about 0.01 and 0.1 inches and covering at least the outer diamond surface of said diamond layer, said heat sink layer being selected from the group consisting of copper, tungsten alloyed with cobalt, and nickel or iron and nickel phosphorus alloys, and said heat sink layer being bonded to said diamond surface via a bonding medium comprising at least one intermediate layer of metal selected from the group consisting of molybdenum, tungsten, titanium, zirconium and chromium.
In a composite tool insert construction in which a layer of sintered polycrystalline diamond is supported on and bonded to a cemented carbide substrate, the improvement comprising a metallic heat sink layer having a thickness between about 0.01 and 0.1 inches and covering the surface of said polycrystalline diamond layer opposite said carbide substrate, said heat sink layer being selected from the group consisting of copper, tungsten alloyed with cobalt, and nickel or iron and nickel phosphorus alloys, and said heat sink layer being bonded to said polycrystalline diamond surface via a bonding medium comprising at least one intermediate layer of metal selected from the group consisting of molybdenum, tungsten, titanium zirconium and chromium.
Dependencies are inferred from the claim text.