Identification card having an IC module

Abstract

A multilayer identification card is equipped with an IC module. The module is arranged on a carrier element which is located in a recess in the multilayer card. The card layers bordering the recess bear supporting layers which are thermoresistant in the range of hot lamination temperatures. This prevents the recess from becoming filled with fluid card material during the hot laminating process, during which the card layers will soften and eventually become fluid. Thus, the IC module can advantageously give way within the recess when the card is bent. Further, the supporting layers have a stabilizing effect on the adjacent card layers and thereby prevent irregularities caused by incorporation of the carrier element from being passed onto the card surface. For these reasons, it is also possible to arrange the IC module or the carrier element which bears the module in the area of a magnetic stripe while preventing reading or writing processes from being disturbed by irregularities which would otherwise appear on the surface of the stripe.

Dependencies are inferred from the claim text.