Multiplexed-access scan testable integrated circuit
AssigneeGeneral Electric Company
InventorsPatrick P. Fasang, John P. Shen
Life of this patent
Estimating the term…
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AssigneeGeneral Electric Company
InventorsPatrick P. Fasang, John P. Shen
Estimating the term…
A testable integrated circuit contains additional circuitry which defines--when operable in a test mode--a plurality of scan paths in each of which are connected in series a plurality of bistable elements (specifically, special scan path flip-flops) isolated from the integrated circuit combinational circuits. The input and output ends of these scan paths are connected by multi-level demultiplexer and multiplexer arrangements with the input and output pins, respectively, of the integrated circuit. The last level demultiplexer and the last level multiplexer include first groups of connections with the input and output ends of the scan paths, respectively, and second groups of connections with the input and output ends of the mission logic. The demultiplexers, the multiplexers and the scan path flip-flops are operable between mission and test modes upon the application of a mode control signal thereto. When the circuit is in the test mode, a test signal applied to the inputs of the scan paths is monitored at the output ends of the paths to indicate the correctness of operation of the SPFF's in each path. Composite test vectors are then applied for testing the combinational circuits via the SPFF's and primary inputs to the said combinational circuits.
A testable digital integrated circuit chip having input and output pins, respectively, comprising
The method of testing the bistable and combinational circuit elements of an integrated circuit chip normally connected to define an operational function mission logic, each bistable element comprising a scan path flip-flop operable between mission and test modes, which comprises the steps of
Dependencies are inferred from the claim text.