Methods and apparatus for connecting closely spaced large conductor arrays employing multi-conductor carrier boards

A method for making connections to a plurality of closely spaced parallel lines located on a panel with said lines arranged on said panel parallel to each other from a first to a last line, comprising the steps of:

• placing said panel on a base plate assembly with said panel placed in a central area to allow the sides of said base plate to frame said panel with said panel lines facing said base plate,
• positioning a series of extending pins on said base plate with said pins positioned in first and second rows, with each pin in said first row positioned along the same line as another pin in said second row, with said line parallel to said panel lines,
• placing a separate carrier board between separate pins in said first and second rows with said carrier board having on a top surface a group of parallel conductive lines for contacting a group of panel lines,
• placing a conductive strip between said conductive lines on said carrier boards and said panel,
• exerting a pressure between said panel and said base plate assembly to force said panel towards said base plate to cause said conductive strip to firmly contact said panel lines and said carrier board lines.

Apparatus for connecting to a plurality of closely spaced conductive lines of the type located on a panel with said lines being parallel to one another and closely stacked in a parallel array from a first line to a last line from one side to another side of said panel, comprising in combination therewith,

• a base plate having a larger area than said panel with said panel positioned in the center of said base plate with said line pattern facing said base plate to allow said plate to frame said panel about the sides thereof, said base plate having a first and a second row of extending pins along one side, with said first row of pins positioned beneath said panel and with said second row spaced from said first row, whereby each pin in said first row is on a common line with a pin in said second row with said common line being parallel to said panel lines,
• separate carrier boards each having first and second sides with each side having a datum aperture each coacting with a pin of the first row and a pin of the second row to position each board parallel to said common line, each carrier board having a group of conductive lines on a top surface with said lines aligned parallel to said common line between said pins,
• a conductive strip positioned between said panel and the top surfaces of said carrier boards,
• and pressure exerting means coupling said base plate to said panel to force the two together to assure contact via said conductive strip between said panel lines and said carrier board lines.