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AssigneeMatsushita Electronics Corporation
InventorsKenichi Tateno, Masami Yokozawa, Hiroyuki Fujii, Mikio Nishikawa, Michio Katoh, Fujio Wada
Estimating the term…
A method for manufacturing a plastic encapsulated semiconductor device is provided which comprises the steps of: clamping by upper and lower molds at least external leads and strips of a semiconductor device assembly formed using a lead frame which has a first connecting band connected to the external leads extending from one side of a substrate support further used as a heat sink, and a second connecting band connected to the strips having portions of small cross-sectional areas and of a predetermined length and extending from the other side of the substrate support, the cross sections being perpendicular to an extending direction of the strips, so that the substrate support may float in a cavity formed by the upper and lower molds and parts of the portions of small cross-sectional areas may be disposed in the cavity and the remaining parts thereof may be disposed between the upper and lower molds; injecting a plastic into the cavity; and cutting the portions of small cross-sectional areas of the strips which extend outside a plastic encapsulating housing along the end face of the plastic encapsulating housing and cutting a connecting portion between the external leads and the first connecting band. Also provided is a lead frame having the strips as decribed above. A plastic layer of desired thickness can be formed on the rear surface of the substrate support. Cutting of the strips from the plastic encapsulating housing is easy and reliable.
A lead frame comprising a first connecting band, a plurality of external leads extending in one direction from said first connecting band, a substrate support having a rear surface and which serves as a heat sink connected at one side thereof to a free end of one of said external leads, a plurality of support strips, each having a portion of small cross-sectional area and being of a predetermined length and extending in a lengthwise direction between portions of larger cross-sectional areas of the respective strip, the cross sections of said portions of small cross-sectional areas being taken perpendicular to said lengthwise direction of said strips, and one end of said strip is connected to another side of said substrate support opposite to the one side connected to said external leads, and a second connecting band extending parallel to said first connecting band with said substrate support disposed therebetween, and connected to opposite ends of said strips, said strips having a smaller thickness than said substrate support and rear surfaces of said strips being at a higher level than the rear surface of said substrate support.
Dependencies are inferred from the claim text.