Radiation curable pressure-sensitive adhesive composition
AssigneeHitachi Chemical Company, Ltd.
InventorsTomohisa Ohta, Akihiko Dobashi, Yasuyuki Seki
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Abstract
A radiation curable pressure-sensitive adhesive composition comprising 100 parts by weight of a liquid oligomer having one or more acrylic unsaturated double bonds in its molecule, 0.2 to 20 parts by weight of a thiol compound and 0.5 to 30 parts by weight of acrylic monomer has high cohesion and is excellent in adhesiveness.
Claims5
A radiation curable pressure-sensitive adhesive composition which comprises 100 parts by weight of a liquid oilgomer having one or more acrylic unsaturated double bonds in its molecule, 0.2 to 20 parts by weight of a thiol compound and 0.5 to 30 parts by weight of at least one acrylic monomer having an acidic group selected from the group consisting of acrylic acid, methacrylic acid, acryloyloxyethyl hydrogenphthalate, 2-acrylamide-2-methylpropane-sulfonic acid, 3-chloro-2-acidophosphoxypropyl methacrylate, 2-acidophos-phoxyethyl acrylate, 2-acidophosphoxypropyl methacrylate, di(2-methacryloyloxyethyl) phosphate, and di(2-acryloyloxyethyl) phosphate.
Dependencies are inferred from the claim text.